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The base material used for the single-sided and double-sided non-metallised printed circuit boards is CEM1 (glass fibre reinforced epoxy resin paper laminate) or FR4 (glass fibre epoxy resin laminate). For FR4 we also use high Tg materials (Tg = glass transition temperature) in order to meet your needs for higher endurance temperatures.
Only FR4 material is used for double-layer metallised printed circuit boards and multilayer printed circuit boards with up to 20 layers.
Needless to say we use high Tg materials here too.
| Material |
Material thickness |
Copper layer thickness |
TG |
| CEM1 |
0,8 - 3,2mm (other thicknesses on request) |
17,5 µm, 35 µm, 70 µm, 105 µm |
135 |
| FR4 |
0,8 - 3,2mm (other thicknesses on request) |
18 µm, 35 µm, 70 µm |
135/150/170 |
| Multilayer |
Inner layer core thickness: at least 0,05 mm
Total thickness: 0,8 mm - 3,2 mm |
Inner layer copper thickness: 17,5 µm, 35 µm, 70 µm, 105 µm
Outer layer copper thickness : 17,5 µm, 35 µm, 70 µm |
135/150/170 |
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Technologies