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Thanks to our development work in new printed circuit board technology, like FELAM® Thermoline and FELAM® Glasline, we also specialise in manufacturing prototypes. With our prototypes we assist you in your development work right up to readiness for start of production regardless of whether the production run will be a one-off involving low figures or whether the market will require production outside Europe. FELA remains your partner throughout the process.
Within a delivery period of 2 or more days, we produce your prototypes for you using the following techniques:
- one-sided printed circuit boards using different materials and thicknesses
- printed circuit boards with through-connections on two sides using different materials and different copper thicknesses
- multilayer with through-connections of up to 8 layers using different materials and different copper thicknesses
- metal core circuit boards, single-sided, double-sided with through-connections and multilayer with up to 20 layers
Technical data
- Thickness of between 0.8 mm and 4.00 mm
- Min. core thickness 50 μm
- Conductor path width and spacing 150 μm
- Min. mechanical hole diameter 0.25 mm
- Max. Cu thickness on inside 105 μm / on outside 105 μm
- Buried via
- Blind via
- Jump V-cutting
strong>Materials
- FR-4 to Tg 170, metal core, aluminium and copper
- Halogen-free and RoHS-compliant base material
Surface coatings
- Probimer solder mask
- HAL (Hot-Air-Levelling procedure)
- Chemical Sn
- Chemical Ni/Au
- Galvanic Ni/Au
- Soft gold
- OSP (Organic Surface Protection)
- Chemical Ag
Screen printing variants
- Legend print
- Via print
- Carbon paint
- Solder resist
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