We offer almost all types of printed circuit boards, from single-sided printed circuit boards in small quantities up to multilayers with large number of layers in great quantities and HDI boards.
| Technologies
|
| Description |
2-16 layers, HDI-Technology |
| Base material |
FR4, FR5, non halogen material |
| Board thickness |
0.5-3.2 mm |
| Conductor path width and spacing |
75 / 75 µm |
| Min. mechanical hole diameter |
0.2 mm |
| Min. laser hole diameter |
100 µm |
| Surfaces |
- OSP (Organic Surface Protection)
- HAL (Hot Air Levelling)
- Chemical Nickel / Gold
- Chemical Silver
- Chemical Tin
- Bond Gold
|
| Processing contours |
Cutting, scoring, punching |
The production of all printed circuits corresponds to the following standards:
- IPC-A-600
- PERFAG
- special customer specifications
- UL / CSA approval corresponding to 94 V-0
|
Service